(MENAFNEditorial)
The thin wafer market is poised for significant growth over the forecast period owing to rise in demand for ultra-thin wafer semiconductors. On account of rapid technological developments complexities occurring with the traditional semiconductors have been replaced with ultra-thin wafer semiconductors which have a thickness of 40 mm. The thin wafers industry is anticipated to have a considerable share of overall semiconductor market over the next six years. Temporary bonding is required by various electronic devices having innovative packaging such as IGBTs LEDs and RF equipment. The requirement of consumer electronics memory disks and wireless devices is satisfied by the key vendors in the thin wafer market. Thin wafers systems offer maintenance and support for reducing the thickness of smart phones bundles. The deployment of electronic and thermal devices is estimated to positively influence the thin wafers market owing to advancements in electronic and semiconductor devices.
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Growing adoption of portable devices and increase in thin wafer users are the key factors that are forecasted to positively impact market growth. The extension of semiconductor industry along with the increasing awareness of thin wafer semiconductors is expected to propel market growth through the next years. Under the influence of cracking or stress ultra-thin wafers are more prone to being damaged owing to the volatile nature of ultra-thin wafers. During the internal process the dies used in thin wafers may come off easily which may restrain market growth. However usage and implementation of the wafer support system would act as a key market opportunity over the next six years.
Low cost and high performance devices are needed for a variety of applications in the thin wafer market. Temporary bonding has several application areas in the thin wafer market such as advanced packaging applications power devices as well as RF devices. The temporary bonding systems are estimated to fuel the thin wafers market through the next six years. On the basis of application the market can be segmented into power devices CMOS image sensors MEMS and advanced packaging devices such as LEDs 3D TSV/Interposers and memory & logic.
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